Novati licenses 3DIC bonding technology from Ziptronix

01/16/2013 | EE Times

Novati Technologies, which took over the former SVTC wafer fabrication plant in Austin, Texas, licensed direct oxide bonding technology from Ziptronix that can be used in packaging 3DICs. "Adding Ziptronix 3D process technologies to Novati's existing wafer fabrication and testing facilities enables Novati to become the first open-platform, full-line foundry in the world offering 3D stacking services and test to all its customers," Novati CEO Dave Anderson said in a statement.

View Full Article in:

EE Times

Published in Brief:

SmartBrief Job Listings for Tech

Job Title Company Location
Product Marketing Consultant
Sand Cherry Associates
Philadelphia, PA