Novati licenses 3DIC bonding technology from Ziptronix

01/16/2013 | EE Times

Novati Technologies, which took over the former SVTC wafer fabrication plant in Austin, Texas, licensed direct oxide bonding technology from Ziptronix that can be used in packaging 3DICs. "Adding Ziptronix 3D process technologies to Novati's existing wafer fabrication and testing facilities enables Novati to become the first open-platform, full-line foundry in the world offering 3D stacking services and test to all its customers," Novati CEO Dave Anderson said in a statement.

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