CEA-Leti offers technology platform for 3DIC packaging

01/31/2012 | ElectroIQ

CEA-Leti has brought out its Open 3D platform, which offers three-dimensional IC packaging technologies to its academic and industrial partners. The France-based research and technology development organization is providing mature and "off-the-shelf" 3DIC technologies in chip design and layout, interconnections (including through-silicon vias), reliability tests and final packaging for chips and full systems.

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