Cambridge develops 3DIC with spintronics technology

02/3/2013 | Electronics Weekly (U.K.)

Cambridge University has come up with a 3D chip incorporating spintronics, which uses the spin of electrons to store or transmit data. The 3DIC has three layers, each only a few atoms deep, and can move data in horizontal and vertical directions, this article notes.

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Electronics Weekly (U.K.)

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