IBM details future IC fabrication processes

02/13/2013 | EE Times

Representatives of IBM provided details of what the company plans to do in making future generations of semiconductors, such as substituting double patterning with immersion lithography in the place of extreme ultraviolet lithography. IBM's Gary Patton said, "I believe [complementary metal-oxide semiconductor] scaling will continue, [but] it will require disruptive technologies such as carbon nanotubes and silicon photonics."

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