IC manufacturing issues loom in transition to 20nm chips

02/17/2012 | SemiMD.com

The upcoming industry transition from 28-nanometer features to 20nm is expected to pose more semiconductor manufacturing challenges than previous transitions, according to speakers at the Advanced Lithography Conference. More challenging still is the next leap, to the 14nm process node, if extreme-ultraviolet lithography isn't commercially viable in the future, it was said.

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