LTE multi-mode chipsets are offered by Qualcomm, HiSilicon

02/27/2012 | EE Times

Qualcomm and HiSilicon have introduced chipsets that support both the Frequency-Division and Time-Division versions of the Long-Term Evolution wireless communications standard. Qualcomm is showing a multiband chipset made with 28-nanometer features at the Mobile World Congress in Barcelona, Spain, while HiSilicon's device was fabricated with a 40nm process. China Mobile is pushing toward adoption of a TD/FDD LTE network in Hong Kong, and Vodafone is also supporting the unified LTE technology.

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