Spansion, UMC collaborate on 40nm process combining logic, memory

03/7/2013 | EE Times India (free registration)

Spansion is working with United Microelectronics to combine the foundry's 40-nanometer LP process for logic chips with Spansion's embedded Charge Trap flash memory technology, this article notes. "Collaborating with UMC furthers Spansion's licensing strategy," said John Kispert, Spansion president and CEO.

View Full Article in:

EE Times India (free registration)

Published in Brief:

SmartBrief Job Listings for Tech

Job Title Company Location
Director Business and Legal Affairs
The Weather Channel
Atlanta, GA