Qualcomm RFIC could shake up front-end, power amp market

03/14/2013 | Electronics Weekly (U.K.)

Qualcomm's introduction of the RF360 radio-frequency front-end chip for mobile devices could be a game-changer in the market for RF front-end modules and power amplifiers, according to Strategy Analytics. The market research firm's Christopher Taylor notes Qualcomm is offering a complementary metal-oxide semiconductor power amp as an alternative to multiband, multimode PAs made with gallium arsenide.

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Electronics Weekly (U.K.)

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