3DIC tech chatter up; volume production is years away

03/25/2012 | SemiMD.com

While progress is being made on 3D chip technology, volume production of such ICs may be two to 10 years in the future, according to speakers at a conference in San Jose, Calif. Some chipmakers are pressing ahead with 2.5D chip technology as a steppingstone to wider adoption of full 3DIC packaging, Mark LaPedus writes.

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