Xilinx exec: 3D stacking solves integration issue

03/28/2013 | EE Times Asia (free registration)

Stacking chips in a single package is the answer to integrating multiple functions, Xilinx's Liam Madden said in a keynote address at the International Symposium on Physical Systems. "For many years, designers kept digital logic, memory and analog functions on separate chips -- each taking advantage of different process technologies," he said. "On the other side are system-on-a-chip solutions, which integrate all three functions on the same die. However now there is a third alternative that takes advantage of both worlds -- namely 3D stacking."

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