GlobalFoundries makes 20nm 3DICs with TSVs

04/2/2013 | Electronics Weekly (U.K.) · EE Times

GlobalFoundries reported it has successfully stacked 20-nanometer ICs in a package, connecting the chips with through-silicon vias. Volume production of these 20nm 3DICs is scheduled for 2015, which is a year later than the foundry previously expected to turn out the chips in commercial quantities.

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Electronics Weekly (U.K.) · EE Times

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