Time to embrace 2.5D, 3DIC standards, panelists assert

04/16/2012 | SemiMD.com

The semiconductor industry must take a more active role in developing and implementing standards for 2.5D and 3D chips, according to panelists speaking at the Mentor Graphics User Group Meeting in Santa Clara, Calif. "2.5D will go on for a long time as a placeholder" before stacked 3DICs become practical, said Matthew Hogan, Mentor's Calibre marketing engineer.

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