TSMC CTO touts 3DIC capabilities to make "system super-chips"

05/14/2013 | EE Times

Jack Sun, Taiwan Semiconductor Manufacturing's vice president of research and development and its chief technology officer, says his foundry has the capability to make "system super-chips" with its 3DIC technology. "[T]he driver of future growth is mobile systems that people want to take everywhere, connected to anybody at anytime, which can all be enabled with silicon-based system-level packaging that is smaller, lighter and lower power," he said.

View Full Article in:

EE Times

Published in Brief:

SmartBrief Job Listings for Tech

Job Title Company Location
Director Business and Legal Affairs
The Weather Channel
Atlanta, GA