Yole: Micron/Elpida combo will lead in 2.5/3D packaging patents

05/16/2013 | Electronics Weekly (U.K.)

The forthcoming merger of Micron Technology and Elpida Memory will make Micron the semiconductor industry's largest holder of 2.5D and 3DIC packaging patents, according to Yole Developpement. Micron will overtake IBM and Samsung Electronics in adding Elpida's patent portfolio, the market research firm reports.

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Electronics Weekly (U.K.)

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