IDT exec: Packaging is essential in advanced chips

05/22/2013 | Electronics Weekly (U.K.)

Pietro Polidori of Integrated Device Technology addresses a number of semiconductor technology issues in this interview, including the increasing importance of IC packaging. "Advances in packaging technology, including TSVs, WLCSP, HDL, 2.5D and 3D packaging, copper pillars and multichip packages are driving integration toward smaller and smaller footprints," he says.

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Electronics Weekly (U.K.)

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