2.5D, 3D packaging posing manufacturing, design challenges

08/11/2011 | ElectroIQ

Ron Huemoeller, Amkor's senior vice president of advanced 3D interconnects, zeroes in on the importance of silicon interposers and other issues in 2.5D packaging in this video interview. In the transition to 3D packaging, Huemoeller emphasizes that the industry lacks electronic design automation software tools, and thermal issues are presenting a challenge.

View Full Article in:


Published in Brief: