Form factors play a role in malleable packaging materials

08/16/2011 | Design News

Intel researchers are collaborating with scientists at Carnegie Mellon University on developing transparent silicon dioxide hemispheres that can be reshaped using electrical impulses for semiconductor packaging. Meanwhile, Raytheon has patented a method for shaping a polymer with an electromagnetic field, which may lead to prospects for packaging that can be molded to fit a variety of electronics form factors.

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