Infineon, research partners develop smaller IC packages

08/22/2013 | EE Times India (free registration)

Infineon Technologies and more than three dozen European research partners have completed work on the Efficient Silicon Multi-Chip System-in-Package project, aimed at developing smaller packaging for chips going into various applications. The partners tried out more than 20 test vehicles in the project and concluded that new test flows, probe stations and probe adapters are required for three-dimensional system-in-package technology.

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