ASE targets low pin-number IC packaging for growth

08/30/2011 | DigiTimes

Advanced Semiconductor Engineering, noting that wire-bond packaging of low pin-number chips is expected to grow 19% per year through 2015, is looking to capture such production from integrated device manufacturers, such as Texas Instruments and Toshiba. ASE claims its costs for packaging low pin-number ICs, including discrete and logic chips, are 10% to 20% lower than those of IDMs.

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