ST touts breakthrough in using TSV for MEMS chip making

10/14/2011 | EE Times India (free registration)

Chipmaker STMicroelectronics is touting its use of Through-Silicon Via technology in high-volume MEMS production, saying the technology will provide greater functional integration and performance while also shrinking MEMS chip size. Industry watchers say it could be a breakthrough technology for the consumer mobile-device market.

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