TSMC plans R&D wafer fab for advanced manufacturing technology

10/24/2012 | Wall Street Journal, The

Taiwan Semiconductor Manufacturing plans to put up a wafer fabrication facility in 2016 where it will conduct research and development on 7-nanometer processes using 18-inch silicon wafers. The foundry is currently making chips with 28nm features on 12-inch wafers. "More advanced technology is inevitable and necessary. Our plan is to give our clients a road map for the future," said Elizabeth Sun, a TSMC spokeswoman.

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