Samsung achieves tape-out of test chips with 14nm FinFETs

12/21/2012 |

Samsung Electronics reported it has been able to tape out its first test chips that contain FinFETs with dimensions of 14 nanometers. The chipmaker employed a Cortex-A7 design from ARM Holdings for the test chips, along with IC design software from Cadence Design Systems, Mentor Graphics and Synopsys.

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