Semiconductors
Top stories summarized by our editors
4/18/2018

Researchers at Spain's Catalan Institute of Nanoscience and Nanotechnology report developing a bottom-up method of producing graphene that contains a bandgap. This method could lend itself to volume production of the 2D material, while becoming more useful in developing semiconductor devices, they say.

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ExtremeTech
4/18/2018

Innotron Memory intends to commence volume production of 8-gigabit DDR4 DRAMs next year after a planned period of trial production near the end of this year. Innotron CEO David NK Wang said production equipment is being moved into the company's 12-inch wafer fabrication facility, construction of which was finished in January.

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DigiTimes
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Innotron Memory
4/18/2018

EnSilica has achieved Arm Approved Design Partner status, building on its experience in integrating third-party intellectual property into chip designs since 2001.

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Electronics360
4/18/2018

Fujian Jin Hua Integrated Circuit is reportedly ahead on its construction schedule for its 12-inch wafer fabrication facility and will be able to start installing production equipment soon, industry sources say. The DRAM startup could begin volume production as soon as in the third quarter of this year.

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DigiTimes
4/18/2018

The EU's Efficient Structures and Processes for Reliable Perovskite Solar Modules project will be coordinated by imec, the Belgian research institute, with the aim of promoting market adoption of perovskite solar cells and modules. The three-year project has EU funding of more than $6.2 million.

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New Electronics
4/18/2018

Researchers in China and Germany are touting a type of silver sulfide -- an inorganic semiconductor material -- that can be ductile at room temperature. The material could be used to make flexible devices, such as biosensors and optoelectronics, the team says.

4/18/2018

The promise of faster data speeds and lower latency is driving development of 5G wireless chips, yet there are a number of issues related to their design. "With 5G there will be multiple radios, more advanced technology, while faster and more bleeding-edge technology nodes, such as 12nm and beyond, are expected to play a big role for integrated pieces," said Ron Lowman of Synopsys.

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Ron Lowman
4/17/2018

Qualcomm and other American chip vendors are prohibited from selling semiconductors to ZTE for seven years after a determination by the Commerce Department that the Chinese company had violated a 2017 agreement, reached after ZTE was sanctioned for shipping goods to Iran. Neil Shah of Counterpoint Research estimates Qualcomm collects nearly $500 million a year in revenue related to chips for ZTE smartphones, while Canalys puts that sales figure even higher.

4/17/2018

Samsung Electronics may implement a blockchain ledger to keep tabs on its worldwide shipments, worth billions of dollars. Song Kwang-woo of Samsung SDS, which handles the conglomerate's logistics and IT, said blockchain technology could reduce costs related to shipping by 20%.

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Samsung, Samsung Electronics
4/17/2018

A team of researchers in Finland, Japan and Switzerland used atomic force microscopy to look at atoms in doped graphene nanoribbons, and embedded boron, nitrogen, oxygen and sulfur heteroatoms in the nanoribbons, providing a bandgap in the 2D material. The team plans to conduct further research on the material for its potential use in devices.

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NanotechWeb (U.K.)