Semiconductors
Top stories summarized by our editors
2/21/2018

Intel will spend $5 billion by 2020 to expand production at its wafer fabrication facility in Kiryat Gat, Israel. Eli Cohen, Israel's minister of economy and industry, said, "Intel's choice to continue making major investments in Israel is an important vote of confidence in the State of Israel and the Israeli economy."

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Globes (Israel)
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Intel
2/21/2018

Hatch Entertainment is partnering with Qualcomm to build a cloud-based service for games on demand. Vital to the initiative are servers based on the Qualcomm Centriq 2400 processor, touted as a new standard in cloud computing.

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VentureBeat
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Qualcomm, Hatch Entertainment, Hatch
2/21/2018

Micron Technology is embracing quadruple-level cell technology in its NAND flash memory devices, joining Toshiba and Western Digital in implementing QLC. In upgrading from triple-level cell flash memory, Micron will boost data-storage density by 33% in each memory chip.

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Network World
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Micron, Western Digital, Toshiba
2/21/2018

Fully-depleted silicon-on-insulator processes are gaining in industry adoption as a manufacturing alternative to 3D finFETs, especially for automotive and internet of things chips, this analysis notes. David Fried of Coventor, a Lam Research company, says, "FD-SOI fundamentally enables some different circuit topologies, such as back-biasing and dynamic control, which have made it appetizing for some of these adjacent markets."

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David Fried
2/20/2018

Infineon Technologies has purchased Merus Audio, a developer of energy-efficient integrated audio amplifiers based in Copenhagen, Denmark, for an undisclosed sum. The chipmaker is integrating the startup, founded in 2010, into its Power Management & Multimarket Division.

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Infineon Technologies
2/20/2018

NXP Semiconductors brought out its GreenBox development platform for electric and hybrid vehicles. "Car [original equipment manufacturers] can start developing new hybrid and electric vehicle applications on NXP's S32 automotive processing multicore platform," said Ray Cornyn of NXP.

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EE Times
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NXP Semiconductors
2/20/2018

Researchers at the UK's University of Warwick report coming up with a device that can be put into a lithium-ion cell to provide real-time data on the cell's internal temperatures. With that information, the cell's charging time can be up to five times faster, according to the team.

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CleanTechnica
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University of Warwick
2/20/2018

Intel collaborated with researchers in Germany to develop the BrainScaleS, Loihi and SpiNNaker neuromorphic chip prototypes, which promise to accelerate artificial intelligence and machine learning technology. SpiNNaker has 144 Arm Cortex-M4 cores, capable of computing 36 billion instructions per second.

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New Electronics
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Intel
2/20/2018

Movandi will work with Keysight Technologies, as the startup uses Keysight test equipment to validate its BeamX millimeter-wave front-end beamforming designs. Movandi has developed a radio-frequency IC and beamforming antenna array that could be used in 5G wireless connectivity.

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EE Times
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Movandi, Keysight Technologies
2/20/2018

Pro Design, a supplier of prototyping products for embedded systems, introduced the proFPGA ZU11EG, ZU17EG and ZU19EG modules for development and verification of system-on-a-chip device designs based on Arm's Cortex processor cores. The modules combine Xilinx's Zynq UltraScale+ multiprocessor SoCs with quad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 processors.

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EE Times