Semiconductors
Top editor picks, summarized for you
9/1/2015

Researchers at the University of Oxford and the Rutherford Appleton Laboratory in the UK report being able to attach a carbon dimer structure known as a Klein Edge Doublet on the edge of monolayer graphene. The research team claims that understanding the edge effects and the topology of monolayer graphene could lead to applications in electronics for the 2D carbon material, which is one atom in thickness.

8/31/2015

Rice University researchers have developed a nonvolatile resistive random-access memory with crossbar memory arrays. The 3D memory cells in the chip are said to each be able to store up to 162 gigabits.

Full Story:
Electronic Design
More Summaries:
Rice University
8/31/2015

Researchers in Germany, Switzerland and the US say they have come up with a new technique to produce hexagonal boron-nitrogen-carbon heterostructures. Using surface-assisted cyclodehydrogenation, the research team says the h-BNC material has potential applications in electronics and nonlinear optics.

8/31/2015

Toshiba has introduced the TB9081FG brushless motor pre-driver IC for electric power steering systems. The chip has three-phase pre-driver circuits, fail-safe relay pre-driver circuits and motor current detection circuits for automotive electronics.

Full Story:
New Electronics
More Summaries:
Toshiba
8/31/2015

Differentiation in chip design has become harder due to the consolidation of intellectual-property vendors and semiconductor suppliers, Ed Sperling writes. "Software is what makes the difference," said Zibi Zalewski of Aldec. "Hardware platforms have become more or less similar, while software layers and apps can transform those platforms into different devices and products."

More Summaries:
Ed Sperling, different devices
8/31/2015

China's economic slowdown is expected to hit Asian suppliers of electronic components, who have prospered from the meteoric growth seen in China during this decade. "I don't think this is a bust, but we're going to have to work through the slowdown," said Amir Anvarzadeh of BGC Partners, adding, "Inventories will have to come down."

8/28/2015

Tessera Technologies has agreed to acquire Ziptronix for $39 million in cash, adding the ZiBond technology for 3D chip stacking to its product portfolio. Ziptronix was spun off from RTI International in 2000.

8/28/2015

Researchers at the California Institute of Technology report developing a prototype of an artificial leaf that will convert sunlight and water into clean hydrogen fuel. Caltech's Joint Center for Artificial Photosynthesis received an influx of $122 million of federal funding five years ago.

8/28/2015

Percepio is now offering the FreeRTOS+Trace for Microchip Technology’s PIC32 microcontrollers and the MPLAB X integrated development environment. The Standard Edition of FreeRTOS+Trace for PIC32 is priced at $149 and the Professional Edition is $249.

8/28/2015

A research team at the University of Wisconsin-Madison has come up with the Many-core Integrated Accelerator of Wisconsin, an open-source graphics processing unit design that could be used in general-purpose applications. The MIAOW core was developed over three years.

Full Story:
EE Times