Semiconductors
Top stories summarized by our editors
6/19/2018

The IEEE has issued standards for Ethernet-based time-sensitive networking technology that can be used in next-generation automotive electronics, such as advanced driver-assistance systems, John Swanson of Synopsys writes. He describes how designers can enable TSN tech with automotive-certified intellectual property.

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John Swanson, IEEE
6/18/2018

Four industry CEOs discuss security issues in semiconductor design in this roundtable interview. "Right now it depends on the end market for whether people actually care about security," Arm CEO Simon Segars says.

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Simon Segars, ARM
6/18/2018

The Trump administration's 25% tariffs on a wide variety of goods made in China stands to have a negative effect on US technology and on consumers, this analysis notes. "With the electronics industry having become more consumer focused over the past 20 years, the impact could be severe," said Bill McClean of IC Insights.

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Bill McClean, IC Insights
6/18/2018

The US International Trade Commission staff recommends that a trade judge determine whether Apple infringed a Qualcomm patent, a move that may result in an import ban on certain iPhone models. The staff said in an ITC trial that an Intel modem chip used in iPhones infringes a Qualcomm patent for energy-saving technology.

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Reuters
6/18/2018

IBM Research plans to present two papers on improving the efficiency of artificial intelligence technology in visual analysis applications. The company will detail its BlockDrop software, which will be offered as open-source code, and its neuromorphic hardware for stereo vision.

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EE Times
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IBM Research, IBM
6/18/2018

Nordic Semiconductor's ultra-low-power nRF52840 system-on-a-chip device is now in stock at Mouser Electronics. The SoC supports the Bluetooth 5 and Thread protocols.

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Electronics360
6/18/2018

The choice of a wireless connectivity standard for internet of things devices can be complicated and limiting, Brian Bailey writes. Richard Edgar of Imagination Technologies' Ensigma group says, "Wireless protocol is dictated by the infrastructure, but there are a number of layers to this question."

6/15/2018

Chip design houses in China and Taiwan are contending to secure 8-inch wafer fabrication capacity at local foundries, as a short-term capacity shortfall threatens to become a long-term issue and wafer pricing will rise 20% to 30% during the third quarter, industry sources report. The phenomenon is driven by increasing demand for automotive ICs, internet of things chips, microcontrollers and other devices, while foundries are finding it difficult to obtain 8-inch wafer fabrication equipment, those sources note.

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DigiTimes
6/15/2018

Macronix is planning a $1.5 billion expansion in production capacity during 2019 due to high demand for its memory devices, says Miin Wu, the chipmaker's chairman and CEO. "We believe this situation will continue for a few years, as we are to roll out new products that will consume more capacity," he says.

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Miin Wu, Macronix
6/15/2018

Rice University researchers report synthesizing laser-induced graphene by using a laser to heat polyimide films, then sculpting 3D blocks of graphene foam. The material could be used in batteries and supercapacitors, while also serving as a mold for conductive, flexible sensors, they say.

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The Engineer (U.K.)
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Rice University