Semiconductors
Top stories summarized by our editors
9/20/2017

The new xSPI JEDEC standard for nonvolatile memories is meant for instant-on applications, and maintains the performance of NOR flash memory external to system-on-a-chip devices. Adesto Technologies has incorporated the JEDEC standard in its eXecute-in-Place EcoXiP product line.

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EE Times
9/20/2017

Chip and system designers are encountering new issues with peak power as designs become more complicated, this analysis notes. "When you turn them on from sleep to function mode, that will increase the in-rush current, and the current will spike because it turns everything on," said Jerry Zhao of Cadence Design Systems.

9/19/2017

Intel has been working with Alphabet's Waymo to produce technology that can measure real-time information in autonomous cars. The agreement signals that Intel is further expanding its reach into autonomous-car technology after its $15 billion purchase of Mobileye in March, Alexandria Sage writes.

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Reuters
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Intel, Waymo, Mobileye
9/19/2017

GlobalFoundries has new, enhanced process design kits for radio-frequency chips made with a silicon-on-insulator process. The foundry's 7SW SOI PDK is offered with the SiPEX simulation software from Coupling Wave Solutions.

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GlobalFoundries
9/19/2017

Nexperia brought out a new series of Trench 9 power metal-oxide-semiconductor field-effect transistors qualified for use in automotive electronics. The new MOSFETs conform to the AEC-Q101 quality standard.

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Nexperia
9/19/2017

The ARC division of Synopsys introduced the DesignWare ARC secure intellectual property subsystem, paired with the SEM110 or SEM120D security processors, protected with the company's SecureShield technology. Rich Collins of Synopsys said, "This pre-verified solution addresses a range of attack agents."

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New Electronics
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Synopsys, Rich Collins
9/19/2017

Brite Semiconductor, Semiconductor Manufacturing International and Synopsys have crafted an internet of things platform based on the DesignWare ARC Data Fusion Subsystem from Synopsys. Brite provided the design services integrating the subsystem with an ARC EM9D processor and USB and I3C IP, all to be fabricated with the foundry's ultra-low-power 55-nanometer process.

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EE Times, DigiTimes
9/19/2017

RUSH PCB CEO Akber Roy describes how to design a flexible printed circuit board and to head off potential problems, such as tearing the board during installation. "Although flex boards can be very thin, they're able to weather long duty cycles of flexing," he writes.

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Electronic Design
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printed circuit board
9/18/2017

Artificial-intelligence technology is helping chipmakers bring more efficiency and fewer defects to semiconductor manufacturing, Buddy Nicoson of Micron Technology says. "AI was 25% faster to get to the yield target desired compared to previously without these applications," he notes.

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EE Times
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AI, Micron Technology
9/18/2017

Richard Zhang, founder and former CEO of Semiconductor Manufacturing International, believes talent is crucial to China's ambitions for bolstering its domestic chip industry. Rather than recruiting talent from abroad, China should be aiming for long-term cultivation of talent within the nation, he asserts.

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DigiTimes
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SMIC