Semiconductors
Top stories summarized by our editors
5/25/2017

Data centers can move and analyze data faster through the use of solid-state drives with nonvolatile memory express chips with the PCIe interface, Tien Shiah of Samsung Semiconductor writes. NVMe has a number of advantages over DRAM, Shiah asserts.

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EE Times
5/25/2017

Seven industry experts talk about the forthcoming portable stimulus standard and its impact on design verification technology in this roundtable interview. "It is a way of organizing your thoughts about what the design can do so that you can create interesting verification sequences about it," Tom Fitzpatrick of Mentor, a Siemens Business, says about portable stimulus.

5/25/2017

An automated end-to-end flow is necessary for chip designs that call for functional safety requirements, writes Sanjay Pillay of Austemper Design Systems. "Putting together safety analysis, safety synthesis and fault campaigns to cover the full spectrum of Functional Safety engineering for a certification-oriented application is the optimal solution," he writes.

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EE Times
5/24/2017

Sources say Western Digital is offering $17.8 billion to acquire Toshiba's semiconductor business, with financing from the Innovation Network Corp. of Japan and the Development Bank of Japan. Toshiba hopes to receive at least $17.8 billion for a majority stake in Toshiba Memory, one of the world's largest vendors of NAND flash memory devices.

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The Japan Times
5/24/2017

SK Hynix is reportedly close to a decision on whether to spin off its silicon foundry business, industry sources say. IHS Markit estimates the foundry business has sales of $103.25 million.

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SK Hynix, SK Hynix
5/24/2017

Renault, Qualcomm, Vedecom and others are conducting a trial of "electronic road" technology on a test track in Versailles, France. The trial is meant to demonstrate how the batteries of electric vehicles could be recharged while the car is in motion.

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EE Times
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Qualcomm, Renault
5/24/2017

ON Semiconductor has introduced the FAN6248 advanced synchronous rectifier controller for power supplies. The chip is meant for applications in desktop PCs and servers, gaming, light-emitting diode lighting, large-screen LCD and organic LED televisions, networking and telecommunications.

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New Electronics
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ON Semiconductor, LCD
5/24/2017

Chipmakers are looking to older, more established process nodes for certain applications, eschewing the "bleeding edge" for higher yields in advanced chip design and manufacturing. "The older established nodes will continue for a long time," says Walter Ng of United Microelectronics.

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United Microelectronics
5/24/2017

Cypress Semiconductor has brought out the CYALKIT-E04 Evaluation Kit, meant to enable the design of battery-free systems with a solar power module. Developers can use the kit to evaluate the chip company's power management ICs and Bluetooth Low Energy wireless connectivity chips for internet of things applications.

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Electronics360
5/24/2017

Cascade Microtech and imec collaborated on the development of an automatic pre-bond test system for advanced 3D chips. "Imec provided us with unique early insights into the test requirements for 3DICs, which drove the development of this system," said Jorg Kiesewetter of Cascade Microtech Dresden.

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imec