GlobalFoundries has new, enhanced process design kits for radio-frequency chips made with a silicon-on-insulator process. The foundry's 7SW SOI PDK is offered with the SiPEX simulation software from Coupling Wave Solutions.
Nexperia brought out a new series of Trench 9 power metal-oxide-semiconductor field-effect transistors qualified for use in automotive electronics. The new MOSFETs conform to the AEC-Q101 quality standard.
The ARC division of Synopsys introduced the DesignWare ARC secure intellectual property subsystem, paired with the SEM110 or SEM120D security processors, protected with the company's SecureShield technology. Rich Collins of Synopsys said, "This pre-verified solution addresses a range of attack agents."
Brite Semiconductor, Semiconductor Manufacturing International and Synopsys have crafted an internet of things platform based on the DesignWare ARC Data Fusion Subsystem from Synopsys. Brite provided the design services integrating the subsystem with an ARC EM9D processor and USB and I3C IP, all to be fabricated with the foundry's ultra-low-power 55-nanometer process.
RUSH PCB CEO Akber Roy describes how to design a flexible printed circuit board and to head off potential problems, such as tearing the board during installation. "Although flex boards can be very thin, they're able to weather long duty cycles of flexing," he writes.
Artificial-intelligence technology is helping chipmakers bring more efficiency and fewer defects to semiconductor manufacturing, Buddy Nicoson of Micron Technology says. "AI was 25% faster to get to the yield target desired compared to previously without these applications," he notes.
Richard Zhang, founder and former CEO of Semiconductor Manufacturing International, believes talent is crucial to China's ambitions for bolstering its domestic chip industry. Rather than recruiting talent from abroad, China should be aiming for long-term cultivation of talent within the nation, he asserts.
China's SJ Semiconductor has worked with Qualcomm Technologies to qualify ultra-high-density wafer bumping for chips with 10-nanometer features. The Chinese company last year qualified such wafer bumping for Qualcomm at the 28nm and 14nm process nodes for volume production.
EEMBC has brought out the ULPMark-PeripheralProfile tool to measure the energy efficiency of microcontrollers and programmable peripherals. "Because every application has different needs to optimize power, performance and cost, providing valuable and relevant microcontroller benchmarks requires 'peeling the onion' to understand which MCU is best for each application," said Mark Wallis, co-chair of EEMBC's internet of things working group and a system architect at STMicroelectronics.
Industry sources say MediaTek will conclude development of its 5G chip prototype by the end of this year, with an eye toward trials of the chip in 2018. The chip design company is working with Nokia on a platform for 5G new radio technology that is on scheduled to be offered next year.
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