The long-rumored merger of Qualcomm and NXP Semiconductors may be announced next week, Bloomberg reports, citing people familiar with the process. The chip companies are close to wrapping up negotiations and signing an acquisition agreement, with Qualcomm paying $110 to $120 a share to purchase NXP, reportedly.
Qualcomm today introduced the Snapdragon 625 processor and an internet protocol camera reference design for applications in internet-connected cameras, such as action cameras, bodycams, dashcams, IP security cameras and virtual-reality cameras. The company also unveiled a software development kit and a video analytics application programming interface to help accelerate the development of connected cameras.
Yangtze River Storage Technology might be producing 3D NAND flash memory devices by the end of 2017, one year after opening its 12-inch wafer fabrication facility, industry sources say. Those memory chips are said to have 32 layers.
Mentor Graphics is said to be working with Bank of America to look at its strategic alternatives, including a sale of the company, Reuters reports. Elliott Management recently disclosed taking an 8.1% equity stake in Mentor and Siemens and Dassault Systemes are seen by some as potential acquirers for Mentor.
Taiwan Semiconductor Manufacturing Co. plans to start volume production with a 10-nanometer process this year, followed by 7nm risk production in the second quarter of 2017, 7nm volume production in 2018 and 5nm risk production during the first six months of 2019, said co-CEO Mark Liu. TSMC wants to keep ahead of Samsung Electronics, Intel and GlobalFoundries as its foundry rivals.
Western Digital has debuted a line of solid state drives that are color-coded blue and green. Blue signals high-performance SSDs with up to 1 TB of storage, and green stands for environmentally friendly, low-power-consumption SSDs.
Samsung Electronics has begun volume production of a mobile processor, made with a 14-nanometer process, intended for wearable electronics. The Exynos 7270 application processor is a system-on-a-chip design.
Samsung Electronics is preparing for a quick transition to 3D NAND flash memory devices with 64 stacked layers now that the market for NAND flash has improved. Toshiba has said it will move into volume production of 3D NAND with 64 layers during the first six months of 2017.
Standards for the internet of things are scarce, and it may take five years or more to codify and ratify such standards, executives say. Bluetooth, Wi-Fi, ZigBee and IEEE 802.15.4 are the common wireless connectivity protocols used in the IoT.
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