Intel issued an advisory on Monday, saying the Management Engine feature in its chips could be compromised by attackers, after cybersecurity researchers reported the flaw to the company. The vulnerability may be present in many new internet of things devices, PCs and servers.
Multiple startups are said to be working on high-resolution radar chips for automotive applications, planning to offer an alternative to LiDAR in automated driving, this analysis notes. "With the trend to autonomous driving progressing rapidly, the need for high-resolution radar is also increasing," said Michael Knebelkamp of NXP Semiconductors.
The CoolMOS CFD7, a 600-volt metal-oxide-semiconductor field-effect transistor, is now in volume production at Infineon Technologies. The MOSFET can be used in switched-mode power supplies for electric vehicle charging stations, servers and telecommunications equipment.
Arm and Nano Global are collaborating on a chip design that could recognize and analyze pathogens, along with other living organisms. The resulting chip, expected to be available in 2020, will involve artificial intelligence, blockchain authentication, edge computing, nanotechnology and optics.
Maxim Integrated Products has introduced the DS28E38 DeepCover secure authenticator, a partner security chip to be used alongside microcontrollers for internet of things devices. The DS28E38 has Maxim's ChipDNA physically uncloneable function, providing on-die security keys.
Industry sources predict Huawei Technologies, Xiaomi Technology, Oppo Electronics and other Android smartphone vendors will incorporate 3D sensing capabilities in their 2018 models. The 3D sensing chips were developed jointly by Qualcomm, Truly Opto-electronics and Himax Technologies.
Samsung Electronics is expected to have 2017 chip sales of $65.6 billion, topping Intel's $61 billion, IC Insights estimates. The firm predicts SK Hynix will take third place and Micron Technology fourth with $26.2 billion and $23.4 billion, respectively.
Multiple microchips stacked in a single package represent the semiconductor industry's answer to technical challenges in capabilities, performance and power consumption, Christopher Mims writes. The technology is commonly used with memory chips and is being adopted with different kinds of chips stacked in one package.
ROHM Semiconductor brought out the automotive-grade BA8290xYxx-C line of noise-tolerant operational amplifiers. The AEC-Q100-qualified op-amps can operate in temperatures of minus-40 degrees C to 125 degrees C.
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