Intel CEO Brian Krzanich wants to cash in on fifth-generation wireless communications technology to make up for the chipmaker's earlier mobile missteps. "We've gone with partnerships this time rather than go a lone way, which we did on 4G," he says in this interview.
Foundries and integrated device manufacturers are aiming to fabricate next-generation memory chips, including 3D NAND flash memory devices, magnetoresistive random-access memories and resistive RAMs. United Microelectronics is collaborating with Panasonic Semiconductor Solutions on ReRAM process technology, while Crossbar has teamed with Semiconductor Manufacturing International to produce ReRAM, among other developments.
Oregon State University researchers report the development of a battery that uses hydronium ions as the charge carrier. Hydronium-ion batteries have the potential to provide high-power energy storage on a sustainable basis, they say.
Altreonic announced it has ported its VirtuosoNext Designer real-time operating system to the VF360 3U OpenVPX single-board computer from Sundance Technology. The board combines a Texas Instruments C6678 Keystone multiple-core digital signal processor and an Altera Stratix V field-programmable gate array.
Texas Instruments has introduced the SWIFT TPSM84A21 and TPSM84A22 DC/DC modules for power supplies used in test and measurement, networking and telecommunications. The 4-megahertz, 10-ampere, 12-volt step-down power modules measure 11 millimeters by 15mm, according to the company.
ARM has acquired two firms, Mistbase and NextG-Com, to help in its development of narrow-band internet of things cellular modems. ARM introduced the Cordio-N NB-IoT modem design to provide low-power wide-area-network connectivity for machine-to-machine communications.
Greg Schmergel, chairman and CEO of Nantero, which is developing carbon nanotube random-access memories, discusses the state of memory technology and how it could be improved. He says of his startup's technology, "It is as fast as DRAM, while being nonvolatile."
The Tokyo Institute of Technology has ordered Tesla P100 graphics processing units from Nvidia to assemble its new artificial-intelligence supercomputer, TSUBAME3.0, which is expected to provide twice the performance of its AI predecessor, the TSUBAME2.5. The supercomputer is scheduled to go into service during the summer.
Intel remained the world leader in research and development spending during 2016, with expenditures of $12.74 billion, followed by Qualcomm, Broadcom and Samsung Electronics, IC Insights reports. MediaTek had the biggest increase in R&D spending last year among the top 10 chip companies, a gain of 13% to $1.73 billion, the market research firm estimates.
Samsung Electronics reports its development of a radio-frequency integrated circuit that could be used in fifth-generation wireless networks. The chip, which includes a high-gain, high-efficiency power amplifier, could enable 5G networks to transfer data at 20 gigabits per second by next year.
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