Semiconductors
Top stories summarized by our editors
1/18/2018

Naura Microelectronics Equipment has completed its $15 million acquisition of Akrion Systems, a supplier of semiconductor production equipment, without any reservations raised by the US government. During the Trump administration's year in office, the federal Committee on Foreign Investment in the United States has blocked or delayed several deals where Chinese firms have sought to purchase US companies.

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Reuters
1/18/2018

The Federal Trade Commission issued subpoenas to Broadcom, looking into whether the chip vendor engaged in anticompetitive practices through contracts with its customers. Broadcom said in a statement, "This FTC review is immaterial to our business, does not relate to wireless and has no impact on our proposal to acquire Qualcomm."

1/18/2018

The worldwide production value for automotive electronics will have a compound annual growth rate of 5.4% during the period of 2018 to 2022 and car chips will see a 7% CAGR, while vehicle production in general will grow only 2%, Digitimes Research forecasts. Rising implementation of advanced driver-assistance systems will propel that growth, with demand for computing, data storage, safety and sensing components.

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DigiTimes
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data storage, DigiTimes
1/18/2018

The AS7265X 18-channel multispectral sensor chipset was brought out by ams, meant for multiple spectral sensing applications. The chipset could be used in anti-counterfeiting and authentication measures, fluid quality/spectral component analysis and horticulture.

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New Electronics
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AMS
1/18/2018

Dialog Semiconductor has introduced the GreenPAK SLG46824 and SLG46826 configurable mixed-signal ICs with in-system programming. The chips are the first CMICs debuted by Dialog since its recent acquisition of Silego Technology, a CMIC developer.

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DigiTimes
1/18/2018

Executives in the high-tech industry provide predictions on what will happen this year for companies, devices and semiconductor manufacturing. "2018 will be the takeoff of 28 and 22nm FD-SOI SoC projects," says Graham Bell of Uniquify.

1/17/2018

Rep. Jerry McNerney, D-Calif., sent a letter to the CEOs of Intel, Advanced Micro Devices and Arm Holdings, requesting a briefing on the cybersecurity risks posed by the Meltdown and Spectre vulnerabilities in microchips. "I am looking to better understand the nature of these critical vulnerabilities, the danger they pose to consumers, and what steps your companies plan to take to protect consumers," he wrote in the letter.

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Reuters
1/17/2018

Nanya Technology President Lee Pei-ing asserts that DRAM manufacturers in China should license crucial memory technologies, or their chips developed in-house won't be competitive in the world market. Allegations of stolen intellectual property and trade secrets, along with patent-infringement lawsuits, against Chinese companies will foster a negative image of DRAMs made in China, he says.

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DigiTimes
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Nanya
1/17/2018

In 2017, IBM received more than 1,900 patents related to cloud technology, along with 1,400 artificial intelligence patents, 1,200 cybersecurity patents, and more patents related to blockchain and machine-learning technology. The company also debuted the Power9 processor, which is expected to see use in the IBM Cloud, the Google Cloud and other cloud-based computing services.

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Forbes
1/17/2018

Several companies are working on wireless charging options, including Ossia Inc., which unveiled its wireless charging transmitter at CES last week and reports it's capable of charging devices from up to 30 feet away. Another company, Energous Corp., recently received Federal Communications Commission certification on a similar device, WattUp, which is capable of charging from 3 feet away.

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FCC