Powertech Technology said it is hoping advances to its integrated circuit packaging technology -- including a technique known as through silicon via -- will help it reach its goal of becoming the fourth-leading IC packaging and testing firm by 2014. The company says that among other things it has been working on advancing wafer-level packaging, 3D IC packaging and copper pillar bumping, and its subsidiary -- Macrotech Technology -- has begun construction on a new facility where it will begin commercial development using the technologies.

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