Powerchip Technology, facing slumping demand for PC DRAMs, will cut its output of those parts by half, shifting production at its 300-millimeter wafer fabrication plants to complementary metal-oxide semiconductor sensors, LCD driver ICs and power management chips. The chipmaker will drop monthly production of PC DRAMs to 40,000 wafers, from 80,000 wafers, while boosting non-DRAM production to more than 50,000 wafers a month.

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