A Qualcomm executive outlined the need for standard 3DIC specifications within six months to keep ahead of future chip design requirements. Speaking at the DesignCon conference in Santa Clara, Calif., Riko Radojcic, director of advanced technology engineering at Qualcomm, told attendees, "We have less than a year to put the rest of the key standards in place, otherwise commercial pressures will push EDA and other companies to solve the problems themselves and want to own their solutions."

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