Some technologists have given up on using extreme ultraviolet or maskless multibeam electron-beam lithography for making logic chips with 10-nanometer features, Mark LaPedus writes. For the 7nm process node, the jury is still out on whether those two once-promising technologies will contend, with directed self-assembly and the reliable standby, 193nm immersion lithography with multiple patterning, in the running, he writes.

Full Story:

Related Summaries