Through-silicon via technology is progressing from such niche applications as field-programmable gate arrays and microelectromechanical system devices to mainstream adoption in specialty memory and logic chips, Ed Korczynski writes. He cites the ARM-based networking processor jointly developed by HiSilicon Technologies and Taiwan Semiconductor Manufacturing, and Samsung's volume production of DDR4 memories in registered dual-inline memory modules with TSV as examples of the trend.
Adata Technology plans to offer DDR4 dynamic random-access memory modules for servers, targeting applications in enterprise data centers. The company didn't provide a specific time frame for their availability.
Corsair has introduced Vengeance Extreme dual-channel DDR3 memory kits, capable of storing 8 gigabytes of data and operating at 3 gigahertz. The memory kits will be available this month on the Corsair.com site, priced at $749.99.
Micron Technology intends include NAND flash memory devices with DRAMs in memory modules to be used on the DDR4 bus, which is slated for delivery in the next 18 months. Such hybrid dual-inline memory modules would support both Linux and Windows, this article notes.