Low demand has driven down third-quarter average contract prices by 15% for dynamic random-access memory chips going into servers, DRAMeXchange reports. Prices also are declining for other types of DRAM, such as PC DRAMs and DDR4 registered dual-inline memory modules, the report says.
Diablo Technologies has introduced the Memory1 flash-based dual-inline memory module, which it says can supplant most of the DRAMs used in servers for data centers. Memory1 complies with the DDR4 specification and uses less power than a DRAM, according to Diablo.
Through-silicon via technology is progressing from such niche applications as field-programmable gate arrays and microelectromechanical system devices to mainstream adoption in specialty memory and logic chips, Ed Korczynski writes. He cites the ARM-based networking processor jointly developed by HiSilicon Technologies and Taiwan Semiconductor Manufacturing, and Samsung's volume production of DDR4 memories in registered dual-inline memory modules with TSV as examples of the trend.
Micron Technology intends include NAND flash memory devices with DRAMs in memory modules to be used on the DDR4 bus, which is slated for delivery in the next 18 months. Such hybrid dual-inline memory modules would support both Linux and Windows, this article notes.