5/14/2013

Jack Sun, Taiwan Semiconductor Manufacturing's vice president of research and development and its chief technology officer, says his foundry has the capability to make "system super-chips" with its 3DIC technology. "[T]he driver of future growth is mobile systems that people want to take everywhere, connected to anybody at anytime, which can all be enabled with silicon-based system-level packaging that is smaller, lighter and lower power," he said.

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