Taiwan Semiconductor Manufacturing Co. will turn over data requested by the US government in the midst of the worldwide shortages in crucial components, according to various media reports; the deadline for submitting the data is Nov. 8. The Liberty Times newspaper in Taiwan reports the foundry's wafer fabrication facility in Arizona is being delayed, although TSMC insists that normal progress is being made with the 12-inch wafer fab.
Owing to supply chain issues, the availability of specialty DRAMs and NOR flash memory devices will still fail to meet demand next year, industry sources say. Samsung Electronics and SK Hynix, the world's two largest vendors of memory chips, are said to be reducing their DRAM output and repurposing production capacity to CMOS image sensors, those sources note.
Infineon Technologies is working with Rainforest Connection to develop a monitoring system for identifying wildfires. The effort involves acoustic technology, artificial intelligence and big data analytics.
Advanced Micro Devices is moving toward adopting Taiwan Semiconductor Manufacturing Co.'s system-on-integrated-chit technology for high-performance computing processors, industry sources say. Those microchips will also take advantage of the foundry's backend chip-on-wafer-on-substrate packaging, it was said.
The SC1330 chip was unveiled by Socionext, ZiFiSense and Techsor to provide a way to implement the ZETag cloud tag. The system-on-a-chip device contains a signal processing and digital ICs with the open-source RISC-V technology.
Copper microbumps and solder balls/bumps in advanced packaging are undergoing changes in how they are produced. "The industry is investing more on advanced packaging and has been diligently working to improve system-level interconnection density, reduce the power consumption, achieve a smaller form factor and lower cost by scaling the package-level pitch and integrating more functions into a single package," says Xiao Liu of Brewer Science.
SiFive, the developer of RISC-V processors, could not agree on financial terms for a takeover by Intel, Bloomberg News reports, adding that SiFive is currently contemplating an initial public offering or an acquisition by another big chipmaker. Meanwhile, Intel CEO Pat Gelsinger said the worldwide shortages in crucial components will go on into 2023, telling CNBC in an interview, "We're in the worst of it now; every quarter next year, we'll get incrementally better, but they're not going to have supply-demand balance until 2023."
The US Department of Commerce reports it received requested data from Infineon Technologies and Intel. Ahead of a Nov. 8 deadline for submitting such data, a department spokesperson told Reuters, "Companies including Intel, GM, Infineon and SK Hynix, have indicated that they plan to be very forthcoming with their data."
Infineon Technologies is collaborating with Picovoice to come up with an end-to-end voice platform capable of enabling edge devices to have artificial intelligence voice technology. Infineon's PSoC 6 microcontrollers and XENSIV MEMS microphones are involved in the joint effort.
Geely Automobile Holdings is considering an entry into custom chip designs for its vehicles, while also contemplating electrical motor production and developing batteries for electric vehicles, industry sources say. The Chinese company's Ecarx Technology subsidiary has established a joint venture with Arm China, SiEngine Technology, that will develop automotive system-on-a-chip devices for applications in autonomous driving, microcontrollers and smart cockpits, those sources note.
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