Semiconductors
Top stories summarized by our editors
7/19/2019

Seven industry experts talk about IC design partitioning and its implications for microchip architectures in this roundtable interview. Raymond Nijssen of Achronix Semiconductor says, "One of the difficulties of individual partitions is that their behavior is becoming more dynamic these days."

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Achronix Semiconductor
7/19/2019

Taiwan's suppliers of metal-oxide-semiconductor field-effect transistors are experiencing an uptick in orders from manufacturers of notebook computers and PCs, industry sources say. EST Technology Integration, Sinopower Semiconductor and Niko Semiconductor are among the MOSFET vendors seeing greater order visibility in the second half of 2019, those sources note.

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DigiTimes
7/19/2019

Intel and SAP signed a multi-year agreement that will see the chipmaker's Xeon Scalable processors and Intel Optane DC persistent memory used to optimize SAP's software portfolio. "The goal here is [to expose] a broad portfolio of Intel technologies for the data-centric era, close collaboration with SAP to accelerate the pace of innovation of SAP's entire broad suite of enterprise-class applications, while making it easier for customers to see, test and deploy this technology," Intel's Rajeeb Hazra says.

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TechCrunch
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Intel, SAP
7/19/2019

A moire superlattice of trilayer graphene and hexagonal boron nitride could offer signatures of high-temperature superconductivity, according to researchers of the Lawrence Berkeley National Laboratory and the University of California at Berkeley. The team created their heterostructures by sandwiching exfoliated ABC-TLG and hBN with a dry transfer method.

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Physics World
7/19/2019

Cadence Design Systems unveiled the Cadence Perspec System Methodology Library complying with the Accellera Portable Test and Stimulus Specification 1.0. AMIQ EDA CEO Cristian Amitroaie said, "We collaborated with Cadence using our DVT Eclipse IDE to provide a way to check the library for compliance to the standard."

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New Electronics
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Cadence Design Systems
7/19/2019

The chip packaging and radio-frequency modules for 5G phones are presenting new industry challenges due to their complexity and cost, Mark LaPedus writes. Jan Vardaman of TechSearch International says, "When people talk about millimeter-wave frequencies, it's not only the packaging, but it's the test that goes with it."

7/18/2019

Toshiba Memory, which was sold last year to an investor consortium led by Bain Capital, is rebranding itself as Kioxia, a play on the Japanese word for memory. The name change could be the first step to going public, Shawn Knight writes.

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TechSpot
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Toshiba, Bain Capital
7/18/2019

The trade dispute between Japan and South Korea engendered a 15% increase in spot pricing for DRAMs, a development that could become worrisome for the memory chip market, this analysis notes. "If the ban continues, memory prices will skyrocket like never seen before as 75% of DRAM and 45% of NAND global output is at risk," said Mark Newman of Bernstein.

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Reuters
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Mark Newman, Bernstein
7/18/2019

Taiwan Semiconductor Manufacturing Co. forecasts sales in the current quarter will be between $9.1 billion and $9.2 billion on increasing demand for advanced microchips. "We have passed the bottom of the cycle of our business, and should see our demand increase," TSMC CEO C. C. Wei said.

7/18/2019

STMicroelectronics and Arrow Electronics brought out the SPC5-L9177A-K02 ECU reference design for electronic fuel-injection applications. The reference design incorporates an electronic control unit for automotive electronics.

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New Electronics
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Arrow Electronics