Semiconductors
Top stories summarized by our editors
3/22/2019

Five industry experts discuss what's happening in photomasks for extreme ultraviolet lithography, including mask blank defects, 3D mask effects and mask fabrication, in this roundtable interview. "With EUV, since all materials absorb strongly, you now have to move to a reflective mask," says Emily Gallagher of Imec.

3/22/2019

Intel announced at the Game Developers Conference in San Francisco that its ninth-generation H-series mobile Core processors will come out during the second quarter for use in gaming laptops. Separately, Intel's Steve Long provided more information on the chipmaker's F-series client processors, which were introduced at CES 2019.

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Engadget, CRN (US)
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Intel, Steve Long
3/22/2019

The 8-inch wafer fabrication facility that Taiwan Semiconductor Manufacturing Co. will reportedly construct in Tainan will be handling orders for automotive semiconductors from STMicroelectronics and other foundry customers, industry sources say. Sources also contend that IC design houses in China are directing their orders for 5G, artificial intelligence and internet of things microchips to TSMC, which can make those devices with a 7-nanometer process.

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DigiTimes, DigiTimes
3/22/2019

The SureFit customization service provided by sureCore of Sheffield, England, has delivered high-capacity, low-power static random-access memory subsystems implemented in advanced FinFET processes, according to the company. The firm's SRAM intellectual property is used for applications in artificial intelligence, machine learning and imaging.

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SureFit
3/22/2019

Cog Systems was selected by Qualcomm Technologies to provide virtualization-based security for the chip company's Snapdragon platforms. The cybersecurity software specialist will incorporate its technology in the Snapdragon 855 and other mobile processors used in Android smartphones and internet of things devices.

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New Electronics
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Qualcomm Technologies
3/22/2019

GlobalPlatform is offering open specifications that could lead to the standardization of integrated secure elements, providing a way to combine SIMs, smart cards, smart microSDs and USB tokens in integrated systems. The industry organization published the Open Firmware Loader and Virtual Primary Platform documents.

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New Electronics
3/21/2019

Thanks to continually falling prices for NAND flash memories, PCIe solid-state drives will gain in adoption this year and are expected to achieve a 50% market share by year's end -- equal to the share of SATA SSDs -- industry sources say. Among client SSDs, the unit price of 512-gigabyte SSDs is now the same as the price of a 256GB SSD a year ago.

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DigiTimes, DigiTimes
3/21/2019

Micron Technology reported revenue for its fiscal second quarter, ended Feb. 28, came in at $5.84 billion, slightly higher than average analyst estimates, yet still below $7.35 billion from a year earlier. The memory chip manufacturer forecast revenue in its fiscal third quarter will be between $4.6 billion and $5 billion and that memory market conditions are expected to improve during the latter half of calendar 2019.

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Micron
3/21/2019

Advanced Semiconductor Engineering is reportedly readying its antenna-in-package technology for volume production in 5G millimeter-wave applications, including handsets and internet of things devices, sources familiar with the matter are saying. ASE has installed two microwave chambers at its plant in Kaohsiung, Taiwan.

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DigiTimes
3/21/2019

Power Integrations brought out the InnoMux chipset designed for display power supplies. Power conversion efficiency has improved by 10%, eliminating the need for heat sinks and enabling compliance with the forthcoming ENERGY STAR 8.0 display specification and the CEC power-consumption standard scheduled to go into effect in July.

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New Electronics
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Power Integrations